| IC (40x) |
CD Data (2500x) |
Micro Component
(3-D 50x-300x Zoom) |
CD Data (5000x) |
QFP
(3-D 100x) |
BGA chip
(3-D 200x-100x) |
Through
Hole
(3-D 50x-300x Zoom) |
Gold Plated Pin on IC
( 3-D 50x-300x)
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Gold Plated Pin on IC
(3-D 50x)
25° 35° 45° 55° Angle Views
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Probe (L)
( 3-D 50x-200x)
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size ref. |
Probe (S)
( 3-D 300x)
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Wire Bonding
(3-D 50x-300x) |
