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Micro Electronics
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IC 40x  |
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CD data 2500x |
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CD data 5000x |
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Resistor 3-D 50-400x zoom  |
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QFP 3-D 200-100x |
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BGA ball on a circuit board 3-D 200-100x |
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Through hole check 3-D 50x-400x zoom |
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Pin alignment 3-D 50-400x |
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Pin alignment 50x Angle of visibility at 25, 35, 45, and 55 degrees |
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Wire bonding 3-D 50-400x |
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Wafer probe (L) inspection 3-D 50-400x |
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Wafer probe (S) inspection 3-D 400x |
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Electronic component 150x at 90 degrees using the MXBGAZ |
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BGA sample 320x |
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Lead-free solder lifting off Sn3Pb 80x |
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Wafer 3-D 50x |
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Wafer 3-D 200x |
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Solder ball 3-D 100x |
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CCD chip 7000x |
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Semiconductor
Lens: MX-10C with OL-700
Adapter: AD-10R (Optical Rotary)
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1. 700x Semiconductor |
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2. 2800x 3-D |
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3. 7000x 3-D |
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